Wafer dicing, also known as die singulation, is the process in semiconductor device fabrication by which individual dies are separated from a finished semiconductor wafer, carried out by scribing and breaking, mechanical sawing with a dicing saw, or laser cutting, with every method typically automated for precision. During dicing the wafer is mounted on a sticky dicing tape held on a thin metal frame, and a dicing saw may use a diamond-particle blade spinning at 30,000 revolutions per minute cooled with deionized water; the kerfs it cuts, called die streets, are typically about 75 micrometers wide. Standard practice dices the wafer only after it has first been thinned in a step called back side grinding. The resulting dies, which can range from about 35 millimeters on a side down to just 0.1 millimeter square and are usually rectangular or square, remain on the dicing tape until removed by die-handling equipment such as a die bonder, ready to be packaged or placed directly onto a circuit board as a bare die.
Facts
Core PrincipleIndividual dies are separated from a finished semiconductor wafer by scribing and breaking, mechanical sawing or laser cutting 1 FAQs
What is dice before grind, and why is it used?
Dicing partway first, then grinding the wafer thin so the die separate, which helps avoid backside chipping and cracking.
Dice before grind reverses the usual order of grinding and then dicing. A dicing step first cuts into the wafer to a depth greater than the required final thickness without fully separating it, and the wafer is then thinned to the required thickness, which singulates the die. It is used because backside chipping or cracking can be a problem for some wafers.
Connections
Associated With
Source Die singulation (Wikipedia)Wikipedia contributors
Silicon, Materials Wafer dicing cuts a processed silicon wafer into individual chips.
In Field
Source Die singulation (Wikipedia)Wikipedia contributors
Sources
1. Die singulation (Wikipedia)
Wikipedia contributors, Wikimedia FoundationIntroduction, first sentence
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor.
Associated With: Silicon, Introduction
Materials diced include glass, alumina, silicon, gallium arsenide (GaAs), silicon on sapphire (SoS), ceramics, and delicate compound semiconductors.
In Field: Electrical Engineering, Introduction
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor.
In Group: Semiconductor Fabrication and Electronics Assembly, Introduction
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor.
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