The Wikipedia article on die singulation, also called wafer dicing, consulted for silicon among the materials it separates.
Facts
AuthorWikipedia contributors
PublisherWikimedia Foundation
URLhttps://en.wikipedia.org/wiki/Die_singulation
Source TypeReference Work
Reliability Tier2
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Claims Backed By This Source (6 claims)
This source backs 6 claims across the atlas. As facts: 5 well-attested. As cited relationships: 1 holds.
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- Sources, 5 claims: 5 well-attested.
- Methods, 1 claims: 1 holds.
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