Process steps used to make integrated circuits and to mount components on circuit boards. A member belongs here when the cited article describes it as a semiconductor fabrication or electronics assembly step. The group is one of the groupings under this field in the Technology Atlas, and each member keeps its own entry with its own cited sources and its own place in the field. Its members appear in the Browse By view for the field, so a reader can move from this group to each member entry and to the sources cited there.
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Semiconductor Fabrication and Electronics Assembly
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Photolithography (Wikipedia)
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Photolithography (also known as optical lithography) is a process that uses light to transfer a pattern onto a photoresist layer deposited on a sample, typically a silicon wafer.
Doping, Semiconductor (Wikipedia)
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In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating its electrical, optical and structural properties.
Wire Bonding (Wikipedia)
Wikipedia contributors, Wikimedia FoundationHas Member: Wire Bonding, IntroductionQuote, Has Member: Wire Bonding, Introduction
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
Electron-beam lithography, Wikipedia
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Electron-beam lithography (often abbreviated as e-beam lithography or EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing).
Surface-mount technology, Wikipedia
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Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB).
Die singulation (Wikipedia)
Wikipedia contributors, Wikimedia FoundationHas Member: Wafer Dicing, IntroductionQuote, Has Member: Wafer Dicing, Introduction
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor.
Reflow soldering (Wikipedia)
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Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.
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