Chemical vapor deposition is a materials engineering process for producing thin solid films by exposing a heated substrate to gaseous chemical precursors that react or decompose at its surface, depositing a solid material layer while volatile byproducts are carried away in the gas stream. It can produce coatings and films with high purity and precise thickness control, including semiconductor layers, protective coatings and synthetic diamond, and variants such as plasma-enhanced and low-pressure chemical vapor deposition adapt the basic process for different materials and lower processing temperatures. It became a foundational technique of the semiconductor industry from the mid twentieth century onward for building up the thin films used in integrated circuits.
Facts
Core PrincipleA precursor gas reacts or decomposes at a heated surface, depositing a solid thin film used for high-quality, high-performance materials, widely used to build up electrically conductive layers in semiconductor manufacturing. 1 FAQs
Who named chemical vapor deposition and why?
John M. Blocher, Jr. coined the term in 1960 to tell it apart from physical vapor deposition.
The term chemical vapor deposition was coined in 1960 by John M. Blocher, Jr. He wanted a name that would separate the chemical process, in which precursor gases react at a surface, from physical vapor deposition, often shortened to PVD.
Connections
Associated With
Gallium nitride LED layers are grown by metal-organic chemical vapor deposition.
Source Chemical vapor deposition (Wikipedia)Wikipedia contributors
Silicon, Materials Chemical vapor deposition lays down silicon and silicon compound films in chip fabrication.
In Field
Source Chemical vapor deposition (Wikipedia)Wikipedia contributors
Sources
1. Chemical Vapor Deposition (Wikipedia)
Wikipedia contributors, Wikimedia Foundationlead paragraph, opening sentence
Chemical vapor deposition (CVD) is a thin film deposition method used to produce high-quality, and high-performance, solid materials.
History section, sentence naming John M. Blocher, Jr.
The term chemical vapour deposition was coined in 1960 by John M. Blocher, Jr. who intended to differentiate chemical from physical vapour deposition (PVD).
View the Source Chemical vapor deposition (Wikipedia)
Wikipedia contributors, Wikimedia FoundationAssociated With: Silicon, Introduction
These materials include: silicon (dioxide, carbide, nitride, oxynitride), carbon (fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-κ dielectrics.
In Field: Materials Engineering, Categories
Coatings
In Group: Coating and Deposition Methods, Introduction
Chemical vapor deposition (CVD) is a thin film deposition method used to produce high-quality, and high-performance, solid materials.
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